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SKM 500 GA 174 D Absolute Maximum Ratings Symbol Conditions 1) VCES VCGR IC; ICN ICM VGES Ptot Tj, (Tstg) Visol humidity climate IF = -IC IFM = -ICM IFSM I 2t RGE = 20 k Tcase = 25/80 C Tcase = 25/80 C; tp = 1 ms per IGBT, Tcase = 25 C AC, 1 min. 4) IEC 60721-3-3 IEC 68 T.1 Tcase = 25/80 C Tcase = 25/80 C; tp = 1 ms tp = 10 ms; sin.; Tj = 150 C tp = 10 ms; Tj = 150 C 1700 1700 600 / 440 5) 1200 / 880 20 3100 -40 ... +150 (125) 3400 class 3K7/IE32 40/125/56 600 / 440 1200 / 880 4400 96800 Values Units V V A A V W C V SEMITRANS(R) M Low Loss IGBT Modules SKM 500 GA 174 D Inverse Diode 8) A A A A2s SEMITRANS 4 Characteristics Symbol Conditions 1) V(BR)CES VGE = 0, IC = 8 mA VGE(th) VGE = VCE, IC = 18 mA ICES Tj = 25 C VGE = 0 VCE = VCES Tj = 125 C IGES VGE = 20 V, VCE = 0 VCEsat IC = 400 A VGE = 15 V; IC = 500 A Tj = 25 (125) C gfs VCE = 20 V, IC = 400 A CCHC Cies Coes Cres LCE td(on) tr td(off) tf Eon Eoff VF = VEC VF = VEC VTO rt IRRM Qrr Rthjc Rthjc Rthch per IGBT VGE = 0 VCE = 25 V f = 1 MHz VCC = 1200 V VGE = -15 V / +15 V 3) IC = 400 A, ind. load RGon = RGoff = 3 Tj = 125 C (VCC = 900 V/1200 V) LS = 60 nH (VCC = 900 V/1200 V) IF = 400 A VGE = 0 V; IF = 500 A Tj = 25 (125) C Tj = 125 C Tj = 125 C IF = 400 A; Tj = 25 (125) C2) IF = 400 A; Tj = 25 (125) C2) per IGBT per diode D per module min. typ. - 5,5 0,1 16 - 2,8(3,2) 3,1(3,7) 220 - 27 3,8 1,3 - 350 100 1100 100 170/300 135/210 2,15(1,8) 2,3(2,0) 1,3 1,6 270(550) 70(117) - - - max. - 6,5 1 - 0,3 3,3(3,6) - - 1,4 - - - 20 - - - - - - 2,4(2,2) - 1,5 2,1 - - 0,040 0,070 0,038 Units V V mA mA A V V S nF nF nF nF nH ns ns ns ns mWs mWs V V V m A C C/W C/W C/W VCES 4,5 - - - - - - - - - - - - - - - - - - - - - - - - - - GA Features * N channel, homogeneous Silicon structure (NPT- Non punchthrough IGBT) * Low inductance case * High short circuit capability, self limiting * Fast & soft inverse CAL diodes 8) * Without hard mould * Large clearance (13 mm) and creepage distances (20 mm) Typical Applications * AC inverter drives on mains 575 - 750 VAC * DC bus voltage 750 - 1200 VDC * Public transport (auxiliary syst.) * Switching (not for linear use) Inverse Diode 8) Thermal characteristics 1) 2) 3) 4) 5) 8) Tcase = 25 C, unless otherwise specified IF = - IC, VR = 1200 V, -diF/dt = 5000 A/s, VGE = 0 V Use VGEoff = - 5 ... - 15 V Option Visol = 4000V/1 min add suffix H4" - on request Limited by terminals to IC(DC) = 500 A at Tc = Tterminal 100 C CAL = Controlled Axial Lifetime Technology (c) by SEMIKRON 000828 B 6 - 73 SKM 500 GA 174 D 4000 W 3000 m500ga17.xls - 1 800 mWs 600 m500ga17.xls - 2 Eon Tj = 125 C VCE = 1200 V VGE = + 15 V RG = 3 2000 400 Eoff 1000 Ptot 0 0 TC 20 40 60 80 100 120 140 160 C 200 E 0 0 IC 200 400 600 A 800 Fig. 1 Rated power dissipation Ptot = f (TC) Fig. 2 Turn-on /-off energy = f (IC) 800 mWs 600 m500ga17.xls - 3 Eon Tj = 125 C VCE = 1200 V VGE = + 15 V IC = 400 A 10000 A 1000 m500ga17.xls - 4 tp = 20s 100s 1 pulse TC = 25 C Tj 150 C 400 Eoff 100 1ms 200 E 0 0 RG 5 10 15 20 25 10 IC 10ms (DC) Not for linear use 1 1 VCE 10 100 1000 V 10000 Fig. 3 Turn-on /-off energy = f (RG) Fig. 4 Maximum safe operating area (SOA) IC = f (VCE) m500ga17.xls - 6 2,5 m500ga17.xls - 5 Tj 150 C VGE = 15 V RGoff = 3 IC = 400 A 12 Tj 150 C tsc 10 s VGE = 15 V Lext < 50 nH IC = 400 A 2 di/dt=1000A/s 3000 A/s 5000 A/s 10 di/dt=1000A/s 3000 A/s 5000 A/s 8 1,5 6 allowed numbers of short circuits: <1000 time between short circuits: >1s 1 4 0,5 ICpuls/IC 0 0 VCE 500 1000 1500 V 2000 2 ICSC/IC 0 0 VCE 400 800 1200 1600 V 2000 Fig. 5 Turn-off safe operating area (RBSOA) B 6 - 74 Fig. 6 Safe operating area at short circuit IC = f (VCE) 000828 (c) by SEMIKRON SKM 500 GA 174 D FIGUR7.XLS-V1 10 ICSC/ICN 8 25C VC = 1200 V IC = 400 A RG = 3 Lext 50 nH self-limiting 125C 800 A m500ga17.xls - 8 Tj = 150 C VGE 15V see rem. 5) 600 6 400 4 200 2 IC 0 10 VGE 12 14 16 18 V 20 0 0 T 20 C 40 60 80 100 120 140 160 C Fig. 7 Short circuit current vs. turn-on gate voltage Fig. 8 Rated current vs. temperature IC = f (TC) m500ga17.xls - 10 1000 A 800 VGE = 17V 15V 13V 11V 9V m500ga17.xls - 9 1000 A 800 VGE= 17V 15V 13V 11V 9V 400 600 600 400 200 IC 0 0 VCE 1 2 3 4 V 5 200 IC 0 0 VCE 1 2 3 4 V 5 Fig. 9 Typ. output characteristic, tp = 80 s; 25 C Fig. 10 Typ. output characteristic, tp = 80 s; 125 C m500ga17.xls - 12 Pcond(t) = VCEsat(t) * IC(t) VCEsat(t) = VCE(TO)(Tj) + rCE(Tj) * IC(t) VCE(TO)(Tj) 1,6 + 0,001 (Tj -25) [V] typ.: rCE(Tj) = 0,003 + 0,000008 (Tj -25) [] max.: rCE(Tj) = 0,0041 + 0,000006 (Tj -25) [] +2 valid for VGE = + 15 -1 [V]; IC > 0,3 ICnom 1000 A 800 600 400 200 IC 0 0 VG 2 4 6 8 10 12 V 14 Fig. 11 Saturation characteristic (IGBT) Calculation elements and equations (c) by SEMIKRON Fig. 12 Typ. transfer characteristic, tp = 80 s; VCE = 20 V 000828 B 6 - 75 SKM 500 GA 174 D 20 V 16 800 m500ga17.xls - 13 ICpuls = 400 A 100,00 m500ga17.xls - 14 Cies nF VGE = 0 V f = 1 MHz 1200V 12 10,00 Coes 8 1,00 Cres 4 VGE 0 0 QGate 1000 2000 3000 nC 4000 0,10 0 VCE 10 20 30 V C Fig. 13 Typ. gate charge characteristic 10000 ns tdoff 1000 tdon m500ga17.xls - 15 Fig. 14 Typ. capacitances vs.VCE Tj = 125 C VCE = 1200 V VGE = 15 V RG = 3 ind. load 10000 m500ga17.xls - 16 ns tdoff 1000 tdon Tj = 125 C VCE = 1200 V VGE = 15 V IC = 400 A ind. load tf 100 tr t 10 0 IC 200 400 600 A 800 0 RG 5 10 15 20 100 tr tf t 10 25 Fig. 15 Typ. switching times vs. IC m500ga17.xls - 17 Fig. 16 Typ. switching times vs. gate resistor RG M500GA17.XLS-18 800 A 600 Tj = 125C typ. Tj = 25C typ. Tj =125C max. Tj= 25C max. 100 RG= mJ 80 1,5 VCC = 1200 V Tj = 125 C VGE = 15 V 2,7 60 4 400 40 200 IF 7 15 20 EoffD 0 0 VF 1 2 3 V 0 0 IF 200 400 600 800 A 1000 Fig. 17 Typ. CAL diode forward characteristic B 6 - 76 Fig. 18 Diode turn-off energy dissipation per pulse 000828 (c) by SEMIKRON SKM 500 GA 174 D 0,1 K/W m500ga17.xls - 19 0,1 m500ga17.xls - 20 K/W 0,01 0,01 D=0,5 0,2 0,1 0,05 0,02 0,01 single pulse ZthJC 0,0001 0,00001 0,001 0,0001 ZthJC 0,00001 0,00001 0,0001 tp D=0,50 0,20 0,10 0,05 0,02 0,01 single pulse 0,001 0,001 0,01 0,1 s 1 tp 0,0001 0,001 0,01 0,1 s 1 Fig. 19 Transient thermal impedance of IGBT ZthJC = f (tp); D = tp / tc = tp * f M500GA17.XLS-22 Fig. 20 Transient thermal impedance of inverse CAL diodes ZthJC = f (tp); D = tp / tc = tp * f VCC = 1200 V Tj = 125 C VGE = 15 V 800 A 700 2,7 M500GA17.XLS-23 1000 A 800 RG= 1,5 2,7 RG= 1,5 600 500 400 300 200 100 IRR 0 15 7 4 VCC = 1200 V Tj = 125 C VGE = 15 V IF = 400 A 600 4 400 7 15 200 IRR 0 0 IF 200 400 600 800 A 1000 0 diF/dt 2000 4000 6000 8000 10000 A/us Fig. 22 Typ. CAL diode peak reverse recovery current IRR = f (IF; RG) M500GA17.XLS-24 Fig. 23 Typ. CAL diode peak reverse recovery current IRR = f (di/dt) C 200 180 160 140 120 100 80 60 40 20 Qrr 0 0 diF/dt 2000 4000 6000 200 A 100 A 7 15 400 A 4 RG 1,5 2,7 IF 800 A 600 A VCC = 1200 V Tj = 125 C VGE = 15 V 8000 10000 A/us Fig. 24 Typ. CAL diode recovered charge (c) by SEMIKRON 000828 B 6 - 77 SKM 500 GA 174 D SEMITRANS 4 Case D 59 UL Recognition File no. E 63 532 SKM 500 GA 174 D Dimensions in mm Case outline and circuit diagram Mechanical Data Symbol Conditions min. M1 M2 a w to heatsink, SI Units to heatsink, US Units for terminals, SI Units for terminals, US Units (M6) (M6/M4) 3 27 2,5/1,1 22/10 - - Values typ. - - - - - - Units max. 5 44 5/2 44/18 5x9,81 330 Nm lb.in. Nm lb.in. m/s2 g This is an electrostatic discharge sensitive device (ESDS). Please observe the international standard IEC 747-1, Chapter IX. Twelve devices are supplied in one SEMIBOX D without mounting hardware, which can be ordered separately under Ident No. 33321100 (for 10 SEMITRANS 4) This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. B 6 - 78 000828 (c) by SEMIKRON |
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